Rohm has expanded its automotive low-voltage MOSFET range with products using a new HPLF5060 package (4.9mm × 6.0mm), targeting applications including main inverter control circuits, electric pumps, and LED headlights. Mass production of the new package began in November 2025, with the devices also available through distributors including DigiKey and Farnell.
The HPLF5060 is smaller than the widely used TO-252 package (6.6mm × 10.0mm) while retaining gull-wing leads to address board-mount reliability concerns associated with leadless, narrow-pitch designs at this size class. Copper clip junction technology enables high-current operation within the compact footprint.
Two further package variants are in development. Mass production of the DFN3333 (3.3mm × 3.3mm), which uses wettable flank technology, is scheduled to begin around February 2026. A larger TOLG package (9.9mm × 11.7mm), described as a TO-leaded gull-wing format, is also under development to address high-power, high-reliability applications.
The devices form part of Rohm’s EcoMOS silicon power MOSFET range, which covers automotive, industrial, and home appliance applications. The 40V and 60V ratings place the new products within low-voltage automotive circuit categories where package miniaturisation has increasingly become a design priority.
Source: Rohm
