NEW DELHI: Qualcomm Technologies has partnered with Tata Electronics to manufacture Qualcomm automotive modules in India, deepening the American chip company’s commitment to the “Make in India” initiative and diversifying its production base.
Tata Electronics will manufacture the automotive modules at its upcoming semiconductor assembly and test (OSAT) facility in Jagiroad, Assam.
“The collaboration aims to enable local production of automotive technologies for digital cockpits, infotainment, connectivity, and intelligent vehicle systems, addressing growing demand from Indian and global automakers while enhancing supply chain flexibility and geographic diversification,” the companies said in a joint statement on Friday.
Qualcomm’s automotive modules integrate the Snapdragon Digital Chassis system-on-chips (SoCs) with essential system components into a single, production-ready module, delivering comprehensive electronics platforms for automakers, and expedite transition to software-defined vehicles or SDVs.
“Our work with Tata Electronics marks an important milestone in our automotive growth strategy. As the industry accelerates its shift toward integrated, module-based architectures, expanding manufacturing capacity in key regions becomes essential,” said Nakul Duggal, EVP & group GM (automotive, Industrial and embedded IoT, and robotics), Qualcomm Technologies.
“Together, we will support automakers with scalable, high-performance solutions built in India,” Duggal added.
“Manufacturing in India through Tata Electronics enhances our ability to support both Indian and global OEMs with greater flexibility and supply chain resilience,” said Savi Soin, senior vice president & president, Qualcomm India.
“This collaboration supports Tata Electronics’ objective to become a global hub for high-technology manufacturing as a trusted partner to our leading semiconductor and automotive customers worldwide,” said Randhir Thakur, CEO & MD, Tata Electronics. “We will leverage our Integrated Systems Packaging (ISP) solutions and deliver high-quality, high-performance products to support Qualcomm Technologies’ global product leadership.”
Tata Semiconductor Assembly and Test (TSAT) is building the OSAT facility in Assam with an investment of nearly ₹27,000 crore. It is expected to achieve a production capacity of up to 48 million semiconductor chips per day, significantly boosting India’s advanced manufacturing capabilities.
The TSAT facility will focus on three core platform technologies: Wire Bond, Flip Chip, and a differentiated packaging solution known as Integrated Systems Packaging (ISP).
