Tenstorrent has joined the Chassis program, a three-year EU research initiative aimed at advancing automotive chiplet technology for software-defined vehicles (SDVs). The firm joins a consortium that includes Arteris, Axelera AI, BMW Group, Bosch, CEA, Chips-IT, Fraunhofer, imec, Infineon, Menta, NXP, Renault/Ampere, Siemens, Stellantis-CRF and TTTech-Auto.
Under the programme, Tenstorrent will develop chiplet-based hardware architectures for SDVs. The Bosch-led initiative aims to create scalable, high-performance chiplet platforms that overcome limitations of traditional monolithic systems-on-chip by enabling rapid customisation and reducing development time and costs.
The Chassis program is described as the first Europe-based initiative toward creating an open chiplet platform for automotive applications. It is supported by the Chips Joint Undertaking and will receive funding from France, Germany, the Netherlands and the United Kingdom.
In a statement, Thaddeus Fortenberry, Head of Autonomy at Tenstorrent, said: “The Chassis program, led by Bosch, addresses two key challenges at once—it will reduce wafer-price investment through volume scaling, and improve quality and reliability through industry alignment on die-to-die protocols. Tenstorrent is proud to be a part of this effort.”
Source: PR Newswire
